Unsupervised anomaly detection (UAD) alleviates large labeling efforts by training exclusively on unlabeled in-distribution data and detecting outliers as anomalies. Generally, the assumption prevails that large training datasets allow the training of higher-performing UAD models. However, in this work, we show that UAD with extremely few training samples can already match -- and in some cases even surpass -- the performance of training with the whole training dataset. Building upon this finding, we propose an unsupervised method to reliably identify prototypical samples to further boost UAD performance. We demonstrate the utility of our method on seven different established UAD benchmarks from computer vision, industrial defect detection, and medicine. With just 25 selected samples, we even exceed the performance of full training in $25/67$ categories in these benchmarks. Additionally, we show that the prototypical in-distribution samples identified by our proposed method generalize well across models and datasets and that observing their sample selection criteria allows for a successful manual selection of small subsets of high-performing samples. Our code is available at https://anonymous.4open.science/r/uad_prototypical_samples/
Transformers, renowned for their self-attention mechanism, have achieved state-of-the-art performance across various tasks in natural language processing, computer vision, time-series modeling, etc. However, one of the challenges with deep Transformer models is the oversmoothing problem, where representations across layers converge to indistinguishable values, leading to significant performance degradation. We interpret the original self-attention as a simple graph filter and redesign it from a graph signal processing (GSP) perspective. We propose a graph-filter-based self-attention (GFSA) to learn a general yet effective one, whose complexity, however, is slightly larger than that of the original self-attention mechanism. We demonstrate that GFSA improves the performance of Transformers in various fields, including computer vision, natural language processing, graph-level tasks, speech recognition, and code classification.
In this study, we propose a novel motif-based approach for unsupervised textile anomaly detection that combines the benefits of traditional convolutional neural networks with those of an unsupervised learning paradigm. It consists of five main steps: preprocessing, automatic pattern period extraction, patch extraction, features selection and anomaly detection. This proposed approach uses a new dynamic and heuristic method for feature selection which avoids the drawbacks of initialization of the number of filters (neurons) and their weights, and those of the backpropagation mechanism such as the vanishing gradients, which are common practice in the state-of-the-art methods. The design and training of the network are performed in a dynamic and input domain-based manner and, thus, no ad-hoc configurations are required. Before building the model, only the number of layers and the stride are defined. We do not initialize the weights randomly nor do we define the filter size or number of filters as conventionally done in CNN-based approaches. This reduces effort and time spent on hyperparameter initialization and fine-tuning. Only one defect-free sample is required for training and no further labeled data is needed. The trained network is then used to detect anomalies on defective fabric samples. We demonstrate the effectiveness of our approach on the Patterned Fabrics benchmark dataset. Our algorithm yields reliable and competitive results (on recall, precision, accuracy and f1- measure) compared to state-of-the-art unsupervised approaches, in less time, with efficient training in a single epoch and a lower computational cost.
Accurate Defect detection is crucial for ensuring the trustworthiness of intelligent railway systems. Current approaches rely on single deep-learning models, like CNNs, which employ a large amount of data to capture underlying patterns. Training a new defect classifier with limited samples often leads to overfitting and poor performance on unseen images. To address this, researchers have advocated transfer learning and fine-tuning the pre-trained models. However, using a single backbone network in transfer learning still may cause bottleneck issues and inconsistent performance if it is not suitable for a specific problem domain. To overcome these challenges, we propose a reusable AI-enabled defect detection approach. By combining ensemble learning with transfer learning models (VGG-19, MobileNetV3, and ResNet-50), we improved the classification accuracy and achieved consistent performance at a certain phase of training. Our empirical analysis demonstrates better and more consistent performance compared to other state-of-the-art approaches. The consistency substantiates the reusability of the defect detection system for newly evolved defected rail parts. Therefore we anticipate these findings to benefit further research and development of reusable AI-enabled solutions for railway systems.
As the globalization of semiconductor design and manufacturing processes continues, the demand for defect detection during integrated circuit fabrication stages is becoming increasingly critical, playing a significant role in enhancing the yield of semiconductor products. Traditional wafer map defect pattern detection methods involve manual inspection using electron microscopes to collect sample images, which are then assessed by experts for defects. This approach is labor-intensive and inefficient. Consequently, there is a pressing need to develop a model capable of automatically detecting defects as an alternative to manual operations. In this paper, we propose a method that initially employs a pre-trained VAE model to obtain the fault distribution information of the wafer map. This information serves as guidance, combined with the original image set for semi-supervised model training. During the semi-supervised training, we utilize a teacher-student network for iterative learning. The model presented in this paper is validated on the benchmark dataset WM-811K wafer dataset. The experimental results demonstrate superior classification accuracy and detection performance compared to state-of-the-art models, fulfilling the requirements for industrial applications. Compared to the original architecture, we have achieved significant performance improvement.
In semiconductor manufacturing, lithography has often been the manufacturing step defining the smallest possible pattern dimensions. In recent years, progress has been made towards high-NA (Numerical Aperture) EUVL (Extreme-Ultraviolet-Lithography) paradigm, which promises to advance pattern shrinking (2 nm node and beyond). However, a significant increase in stochastic defects and the complexity of defect detection becomes more pronounced with high-NA. Present defect inspection techniques (both non-machine learning and machine learning based), fail to achieve satisfactory performance at high-NA dimensions. In this work, we investigate the use of the Slicing Aided Hyper Inference (SAHI) framework for improving upon current techniques. Using SAHI, inference is performed on size-increased slices of the SEM images. This leads to the object detector's receptive field being more effective in capturing small defect instances. First, the performance on previously investigated semiconductor datasets is benchmarked across various configurations, and the SAHI approach is demonstrated to substantially enhance the detection of small defects, by approx. 2x. Afterwards, we also demonstrated application of SAHI leads to flawless detection rates on a new test dataset, with scenarios not encountered during training, whereas previous trained models failed. Finally, we formulate an extension of SAHI that does not significantly reduce true-positive predictions while eliminating false-positive predictions.
Deep convolutional neural networks (CNNs) have been widely used in surface defect detection. However, no CNN architecture is suitable for all detection tasks and designing effective task-specific requires considerable effort. The neural architecture search (NAS) technology makes it possible to automatically generate adaptive data-driven networks. Here, we propose a new method called NAS-ASDet to adaptively design network for surface defect detection. First, a refined and industry-appropriate search space that can adaptively adjust the feature distribution is designed, which consists of repeatedly stacked basic novel cells with searchable attention operations. Then, a progressive search strategy with a deep supervision mechanism is used to explore the search space faster and better. This method can design high-performance and lightweight defect detection networks with data scarcity in industrial scenarios. The experimental results on four datasets demonstrate that the proposed method achieves superior performance and a relatively lighter model size compared to other competitive methods, including both manual and NAS-based approaches.
Defect detection plays a crucial role in infrared non-destructive testing systems, offering non-contact, safe, and efficient inspection capabilities. However, challenges such as low resolution, high noise, and uneven heating in infrared thermal images hinder comprehensive and accurate defect detection. In this study, we propose DefectSAM, a novel approach for segmenting defects on highly noisy thermal images based on the widely adopted model, Segment Anything (SAM)\cite{kirillov2023segany}. Harnessing the power of a meticulously curated dataset generated through labor-intensive lab experiments and valuable prompts from experienced experts, DefectSAM surpasses existing state-of-the-art segmentation algorithms and achieves significant improvements in defect detection rates. Notably, DefectSAM excels in detecting weaker and smaller defects on complex and irregular surfaces, reducing the occurrence of missed detections and providing more accurate defect size estimations. Experimental studies conducted on various materials have validated the effectiveness of our solutions in defect detection, which hold significant potential to expedite the evolution of defect detection tools, enabling enhanced inspection capabilities and accuracy in defect identification.
Utilizing Convolutional Neural Networks (CNNs), Recurrent Neural Networks (RNNs), and Generative Adversarial Networks (GANs), our system introduces an innovative approach to defect detection in manufacturing. This technology excels in precisely identifying faults by extracting intricate details from product photographs, utilizing RNNs to detect evolving errors and generating synthetic defect data to bolster the model's robustness and adaptability across various defect scenarios. The project leverages a deep learning framework to automate real-time flaw detection in the manufacturing process. It harnesses extensive datasets of annotated images to discern complex defect patterns. This integrated system seamlessly fits into production workflows, thereby boosting efficiency and elevating product quality. As a result, it reduces waste and operational costs, ultimately enhancing market competitiveness.
This study presents a deep learning methodology using 3-dimensional (3D) convolutional neural networks to detect defects in carbon fiber reinforced polymer composites through volumetric ultrasonic testing data. Acquiring large amounts of ultrasonic training data experimentally is expensive and time-consuming. To address this issue, a synthetic data generation method was extended to incorporate volumetric data. By preserving the complete volumetric data, complex preprocessing is reduced, and the model can utilize spatial and temporal information that is lost during imaging. This enables the model to utilise important features that might be overlooked otherwise. The performance of three architectures were compared. The first two architectures were hand-designed to address the high aspect ratios between the spatial and temporal dimensions. The first architecture reduced dimensionality in the time domain and used cubed kernels for feature extraction. The second architecture used cuboidal kernels to account for the large aspect ratios. The evaluation included comparing the use of max pooling and convolutional layers for dimensionality reduction, with the fully convolutional layers consistently outperforming the models using max pooling. The third architecture was generated through neural architecture search from a modified 3D Residual Neural Network (ResNet) search space. Additionally, domain-specific augmentation methods were incorporated during training, resulting in significant improvements in model performance for all architectures. The mean accuracy improvements ranged from 8.2% to 22.4%. The best performing models achieved mean accuracies of 91.8%, 92.2%, and 100% for the reduction, constant, and discovered architectures, respectively. Whilst maintaining a model size smaller than most 2-dimensional (2D) ResNets.
Robust Principal Component Analysis (RPCA) is a widely used method for recovering low-rank structure from data matrices corrupted by significant and sparse outliers. These corruptions may arise from occlusions, malicious tampering, or other causes for anomalies, and the joint identification of such corruptions with low-rank background is critical for process monitoring and diagnosis. However, existing RPCA methods and their extensions largely do not account for the underlying probabilistic distribution for the data matrices, which in many applications are known and can be highly non-Gaussian. We thus propose a new method called Robust Principal Component Analysis for Exponential Family distributions ($e^{\text{RPCA}}$), which can perform the desired decomposition into low-rank and sparse matrices when such a distribution falls within the exponential family. We present a novel alternating direction method of multiplier optimization algorithm for efficient $e^{\text{RPCA}}$ decomposition. The effectiveness of $e^{\text{RPCA}}$ is then demonstrated in two applications: the first for steel sheet defect detection, and the second for crime activity monitoring in the Atlanta metropolitan area.
Scanning electron microscopy (SEM) is indispensable in diverse applications ranging from microelectronics to food processing because it provides large depth-of-field images with a resolution beyond the optical diffraction limit. However, the technology requires coating conductive films on insulator samples and a vacuum environment. We use deep learning to obtain the mapping relationship between optical super-resolution (OSR) images and SEM domain images, which enables the transformation of OSR images into SEM-like large depth-of-field images. Our custom-built scanning superlens microscopy (SSUM) system, which requires neither coating samples by conductive films nor a vacuum environment, is used to acquire the OSR images with features down to ~80 nm. The peak signal-to-noise ratio (PSNR) and structural similarity index measure values indicate that the deep learning method performs excellently in image-to-image translation, with a PSNR improvement of about 0.74 dB over the optical super-resolution images. The proposed method provides a high level of detail in the reconstructed results, indicating that it has broad applicability to chip-level defect detection, biological sample analysis, forensics, and various other fields.
This survey paper offers a comprehensive review of methodologies utilizing machine learning (ML) classification techniques for identifying wafer defects in semiconductor manufacturing. Despite the growing body of research demonstrating the effectiveness of ML in wafer defect identification, there is a noticeable absence of comprehensive reviews on this subject. This survey attempts to fill this void by amalgamating available literature and providing an in-depth analysis of the advantages, limitations, and potential applications of various ML classification algorithms in the realm of wafer defect detection. An innovative taxonomy of methodologies that we present provides a detailed classification of algorithms into more refined categories and techniques. This taxonomy follows a three-tier structure, starting from broad methodology categories and ending with specific techniques. It aids researchers in comprehending the complex relationships between different algorithms and their techniques. We employ a rigorous Observational and experimental evaluation to rank these varying techniques. For the Observational evaluation, we assess techniques based on a set of four criteria. The experimental evaluation ranks the algorithms employing the same techniques, sub-categories, and categories. Also the paper illuminates the future prospects of ML classification techniques for wafer defect identification, underscoring potential advancements and opportunities for further research in this field
Additive manufacturing (AM) is gaining attention across various industries like healthcare, aerospace, and automotive. However, identifying defects early in the AM process can reduce production costs and improve productivity - a key challenge. This study explored the effectiveness of machine learning (ML) approaches, specifically transfer learning (TL) models, for defect detection in 3D-printed cylinders. Images of cylinders were analyzed using models including VGG16, VGG19, ResNet50, ResNet101, InceptionResNetV2, and MobileNetV2. Performance was compared across two datasets using accuracy, precision, recall, and F1-score metrics. In the first study, VGG16, InceptionResNetV2, and MobileNetV2 achieved perfect scores. In contrast, ResNet50 had the lowest performance, with an average F1-score of 0.32. Similarly, in the second study, MobileNetV2 correctly classified all instances, while ResNet50 struggled with more false positives and fewer true positives, resulting in an F1-score of 0.75. Overall, the findings suggest certain TL models like MobileNetV2 can deliver high accuracy for AM defect classification, although performance varies across algorithms. The results provide insights into model optimization and integration needs for reliable automated defect analysis during 3D printing. By identifying the top-performing TL techniques, this study aims to enhance AM product quality through robust image-based monitoring and inspection.
Defect detection is a critical research area in artificial intelligence. Recently, synthetic data-based self-supervised learning has shown great potential on this task. Although many sophisticated synthesizing strategies exist, little research has been done to investigate the robustness of models when faced with different strategies. In this paper, we focus on this issue and find that existing methods are highly sensitive to them. To alleviate this issue, we present a Discrepancy Aware Framework (DAF), which demonstrates robust performance consistently with simple and cheap strategies across different anomaly detection benchmarks. We hypothesize that the high sensitivity to synthetic data of existing self-supervised methods arises from their heavy reliance on the visual appearance of synthetic data during decoding. In contrast, our method leverages an appearance-agnostic cue to guide the decoder in identifying defects, thereby alleviating its reliance on synthetic appearance. To this end, inspired by existing knowledge distillation methods, we employ a teacher-student network, which is trained based on synthesized outliers, to compute the discrepancy map as the cue. Extensive experiments on two challenging datasets prove the robustness of our method. Under the simple synthesis strategies, it outperforms existing methods by a large margin. Furthermore, it also achieves the state-of-the-art localization performance. Code is available at: https://github.com/caiyuxuan1120/DAF.
Recent years have seen a surge of interest in anomaly detection for tackling industrial defect detection, event detection, etc. However, existing unsupervised anomaly detectors, particularly those for the vision modality, face significant challenges due to redundant information and sparse latent space. Conversely, the language modality performs well due to its relatively single data. This paper tackles the aforementioned challenges for vision modality from a multimodal point of view. Specifically, we propose Cross-modal Guidance (CMG), which consists of Cross-modal Entropy Reduction (CMER) and Cross-modal Linear Embedding (CMLE), to tackle the redundant information issue and sparse space issue, respectively. CMER masks parts of the raw image and computes the matching score with the text. Then, CMER discards irrelevant pixels to make the detector focus on critical contents. To learn a more compact latent space for the vision anomaly detector, CMLE learns a correlation structure matrix from the language modality, and then the latent space of vision modality will be learned with the guidance of the matrix. Thereafter, the vision latent space will get semantically similar images closer. Extensive experiments demonstrate the effectiveness of the proposed methods. Particularly, CMG outperforms the baseline that only uses images by 16.81%. Ablation experiments further confirm the synergy among the proposed methods, as each component depends on the other to achieve optimal performance.
Recently, the application of computer vision for anomaly detection has been under attention in several industrial fields. An important example is oil pipeline defect detection. Failure of one oil pipeline can interrupt the operation of the entire transportation system or cause a far-reaching failure. The automated defect detection could significantly decrease the inspection time and the related costs. However, there is a gap in the related literature when it comes to dealing with this task. The existing studies do not sufficiently cover the research of the Magnetic Flux Leakage data and the preprocessing techniques that allow overcoming the limitations set by the available data. This work focuses on alleviating these issues. Moreover, in doing so, we exploited the recent convolutional neural network structures and proposed robust approaches, aiming to acquire high performance considering the related metrics. The proposed approaches and their applicability were verified using real-world data.
Automatic visual inspection of synthetic fibre ropes (SFRs) is a challenging task in the field of offshore, wind turbine industries, etc. The presence of any defect in SFRs can compromise their structural integrity and pose significant safety risks. Due to the large size and weight of these ropes, it is often impractical to detach and inspect them frequently. Therefore, there is a critical need to develop efficient defect detection methods to assess their remaining useful life (RUL). To address this challenge, a comprehensive dataset has been generated, comprising a total of 6,942 raw images representing both normal and defective SFRs. The dataset encompasses a wide array of defect scenarios which may occur throughout their operational lifespan, including but not limited to placking defects, cut strands, chafings, compressions, core outs and normal. This dataset serves as a resource to support computer vision applications, including object detection, classification, and segmentation, aimed at detecting and analyzing defects in SFRs. The availability of this dataset will facilitate the development and evaluation of robust defect detection algorithms. The aim of generating this dataset is to assist in the development of automated defect detection systems that outperform traditional visual inspection methods, thereby paving the way for safer and more efficient utilization of SFRs across a wide range of applications.
Photonic computing promises faster and more energy-efficient deep neural network (DNN) inference than traditional digital hardware. Advances in photonic computing can have profound impacts on applications such as autonomous driving and defect detection that depend on fast, accurate and energy efficient execution of image segmentation models. In this paper, we investigate image segmentation on photonic accelerators to explore: a) the types of image segmentation DNN architectures that are best suited for photonic accelerators, and b) the throughput and energy efficiency of executing the different image segmentation models on photonic accelerators, along with the trade-offs involved therein. Specifically, we demonstrate that certain segmentation models exhibit negligible loss in accuracy (compared to digital float32 models) when executed on photonic accelerators, and explore the empirical reasoning for their robustness. We also discuss techniques for recovering accuracy in the case of models that do not perform well. Further, we compare throughput (inferences-per-second) and energy consumption estimates for different image segmentation workloads on photonic accelerators. We discuss the challenges and potential optimizations that can help improve the application of photonic accelerators to such computer vision tasks.
Additive Manufacturing (AM) is a transformative manufacturing technology enabling direct fabrication of complex parts layer-be-layer from 3D modeling data. Among AM applications, the fabrication of Functionally Graded Materials (FGMs) has significant importance due to the potential to enhance component performance across several industries. FGMs are manufactured with a gradient composition transition between dissimilar materials, enabling the design of new materials with location-dependent mechanical and physical properties. This study presents a comprehensive review of published literature pertaining to the implementation of Machine Learning (ML) techniques in AM, with an emphasis on ML-based methods for optimizing FGMs fabrication processes. Through an extensive survey of the literature, this review article explores the role of ML in addressing the inherent challenges in FGMs fabrication and encompasses parameter optimization, defect detection, and real-time monitoring. The article also provides a discussion of future research directions and challenges in employing ML-based methods in AM fabrication of FGMs.